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CG Series          

Ink for glass, ceramics, metals, lacquered and
plated surfaces, epoxy resins

CG Series Ink for Printing on Glass, Ceramic and Metals


CG Series is a 2-component pad printing / screen printing ink specifically formulated for printing on glass, ceramic and metals. It has a satin gloss, is opaque and easy to process (even with multi-colors). For best printing on glass CG offers excellent adhesion and dishwasher resistance and has rapid cross-linking and improved resistance with a heat cure after printing. Like all Sapphire inks, CG series is Proposition 65 compliant, which is required in the state of California.

Substrates: Typical Applications:
Glass
Ceramics
Metals and plated surfaces
Chromed surfaces
Hard plastics
Epoxy resins
Lacquered surfaces
Stainless steel mugs
Ceramic mugs
Glass bottles
Coated metal parts
Cosmetic bottles
Light bulbs
Faucets


Mixing Preparation
(2 component usage optional)

Hardeners: CG Series pad printing / screen printing ink cures by cross-linking. Add 1000H-GL Hardener at a ratio of one part hardener to twenty parts inks (20:1) by weight. CG Series ink has an 8/9 hour working pot life.

Thinner: Immediately after adding the hardener the mixture should be thinned to printing viscosity with 10% - 30% Type M or Type MS by weight. Adding thinner will make the ink less viscous and dry slower.

Drying: CG Series ink for printing on glass and other substrates cures by chemical cross-linking. It will be ready for overprinting in less than 60 seconds and will be dust dry in 20 minutes at room temperature. Complete cross-linking (full cure) of the inks is realized in 7-8 days at room temperatures. Complete cure and full resistance to dishwashing cycles and chemicals can be accelerated by addition of heat (140 C) for 30-60 minutes. Application of heat at lower temperatures will promote acceleration of cross-linking and reduce cure time.

Retarder: For fine prints, add Type MS retarder in proportions not to exceed 50% by weight of thinner. Adding too much retarder may inhibit ink transfer from pad to substrate.

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